I NTEGRATED C IRCUITS D IVISION
CPC1916
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
CPC1916Y
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard JESD-625 .
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1916Y
Maximum Temperature x Time
245oC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
e 3
R06
www.ixysic.com
5
相关PDF资料
CPC1918J RELAY SSR 5.25A ISOPLUS264
CPC1926Y RELAY OPTOMOS SP-NO 700MA 4-SIP
CPC1927J RELAY 250VAC/DC ISOPLUS264
CPC1943G OPTOCOUPLER DUAL SCR-OUT 6-DIP
CPC1945G RELAY SSR 1A 16-DIP
CPC1945Y RELAY SSR 1A 8-SIP
CPC1961GS RELAY SSR DUAL AC SP SCR 8-SMD
CPC1961G RELAY OPTOMOS 0.25A DP ZC 8-DIP
相关代理商/技术参数
CPC1918 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS⑩-264 Power Relay
CPC1918_10 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS?-264 Power Relay
CPC1918J 功能描述:固态继电器-PCB安装 Single Pole Power i4-PAC RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC1926 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:OptoMOS? Power SIP Relay
CPC1926_10 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:OptoMOS? Power SIP Relay
CPC1926Y 功能描述:固态继电器-PCB安装 Single Pole Power SIP RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC1927 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS⑩-264 Power Relay
CPC1927_10 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS?-264 Power Relay